項目Item	技術指標Technical parameter
最大加工面積MAX.Board Size 單面/雙面板Single/Double Sided P.C.B	800*550
板厚Board Thickness	0.5mm-3.mm
最小線寬The Min.Track	0.1mm
最小間隙The Min Space	0.1mm
最小孔徑Min Hole Size	0.3mm
孔壁厚度Hile Plating Tolerance PTH Thickness	>0.025mm
金屬化孔孔徑公差PTH .Tolerance	±0.075mm
非金屬化孔孔徑公差NPTH Tolerance	±0.05mm
孔位公差 Hole Position Tolerance	±0.05mm
外形尺寸公差Outine Demesion Tolerance	±0.15mm
絕緣電阻 Insulation Resistance
孔電阻Through Hole Resistance	<300U
抗電強度Dielectric Strength	>1.6kv/mm
耐電流Current Breakdown	10A
抗剝強度Peel-off Strength	1.5n/mm
阻焊劑硬度Solder Mask Abrasion	>5H
熱沖擊Thermal Stress
自熄性Inflammability	94vo
通斷測試電壓E-Test Voltage	10-250V
焊盤拉脫強度Pull of Stength of Peels	100N
可焊性Soder Ability
翹曲度Bow and Twist	<0.01mm/mm